Electronics Manufacturing

Electronic Manufacturing

SMT configuration

Equipment category:NXTⅡ
PCB Size:50x50~~250*600mm;
Components type:0201~~3216;0.3mm Pitch IC;Micro BGA/CSP;Flip-Chip
SMD accuracy:+/-0.050mm 3sigma CPK≧ 1.0;
Production capacity:436363 chip per day

Equipment category:FUJI XP serise
PCB尺寸:50x50~457*356mm;
Components type:0201~~3216;0.3mm Pitch IC;Micro BGA/CSP;Flip-Chip
SMT accuracy:+/-0.030mm 3sigma CPK≧ 1.0;
Production capacity : ≈170000 chip per day